Memory System Performance Enhancements using Measured Signal and Noise Characteristics of Memory Cells

ABSTRACT

A memory sub-system configured to improve performance using signal and noise characteristics of memory cells measured during the execution of a command in a memory component. For example, the memory component is enclosed in an integrated circuit and has a calibration circuit. The signal and noise characteristics are measured by the calibration circuit as a byproduct of executing the command in the memory component. A processing device separate from the memory component transmits the command to the memory component, and receives and processes the signal and noise characteristics to identify an attribute about the memory component. Subsequently, an operation related to data stored in the memory component can be performed based on the attribute.

FIELD OF THE TECHNOLOGY

At least some embodiments disclosed herein relate to memory systems ingeneral, and more particularly, but not limited to memory systems havingenhanced performance implemented using signal and noise characteristicsmeasured for memory cells in the memory systems.

BACKGROUND

A memory sub-system can include one or more memory components that storedata. The memory components can be, for example, non-volatile memorycomponents and volatile memory components. In general, a host system canutilize a memory sub-system to store data at the memory components andto retrieve data from the memory components.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments are illustrated by way of example and not limitation inthe figures of the accompanying drawings in which like referencesindicate similar elements.

FIG. 1 illustrates an example computing system having a memorysub-system in accordance with some embodiments of the presentdisclosure.

FIG. 2 illustrates an integrated circuit memory device having acalibration circuit configured to measure signal and noisecharacteristics according to one embodiment.

FIG. 3 shows an example of measuring signal and noise characteristics toimprove memory read operations according to one embodiment.

FIG. 4 illustrates a controller of a memory sub-system obtaining signaland noise characteristics from a memory device for enhanced operationsof the memory device according to one embodiment.

FIG. 5 shows a method of a memory sub-system enhancing memory operationsusing signal and noise characteristics from a memory device.

FIG. 6 is a block diagram of an example computer system in whichembodiments of the present disclosure can operate.

DETAILED DESCRIPTION

At least some aspects of the present disclosure are directed to a memorysub-system having performance enhanced through using signal and noisecharacteristics measured for memory cells in integrated circuit (IC)memory of memory sub-systems. A memory sub-system can be a storagedevice, a memory module, or a hybrid of a storage device and memorymodule. Examples of storage devices and memory modules are describedbelow in conjunction with FIG. 1. In general, a host system can utilizea memory sub-system that includes one or more memory components, such asmemory devices that store data. The host system can provide data to bestored at the memory sub-system and can request data to be retrievedfrom the memory sub-system.

An integrated circuit memory cell (e.g., a flash memory cell) can beprogrammed to store data by the way of its state at a threshold voltage.For example, if the memory cell is configured/programmed in a state thatallows a substantial current to pass the memory cell at the thresholdvoltage, the memory cell is storing a bit of one; and otherwise, thememory cell is storing a bit of zero. Further, a memory cell can storemultiple bits of data by being configured/programmed differently atmultiple threshold voltages. For example, the memory cell can storemultiple bits of data by having a combination of states at the multiplethreshold voltages; and different combinations of the states of thememory cell at the threshold voltages can be interpreted to representdifferent states of bits of data that is stored in the memory cell.

However, after the states of integrated circuit memory cells areconfigured/programmed using write operations to store data in the memorycells, the optimized threshold voltage for reading the memory cells canshift due to a number of factors, such as charge loss, read disturb,cross-temperature effect (e.g., write and read at different operatingtemperatures), etc., especially when a memory cell is programmed tostore multiple bits of data.

Conventional calibration circuitry has been used to self-calibrate amemory region in applying read level signals to account for shift ofthreshold voltages of memory cells within the memory region. During thecalibration, the calibration circuitry is configured to apply differenttest signals to the memory region to count the numbers of memory cellsthat output a specified data state for the test signals. Based on thecounts, the calibration circuitry determines a read level offset valueas a response to a calibration command.

At least some aspects of the present disclosure address the above andother deficiencies by a controller of a memory sub-system using signaland noise characteristics measured by a memory device for memory cellsin the memory device. Preferably, the memory device measures the signaland noise characteristics during regular read operations. The signal andnoise characteristics can be used by the controller to determineoptimized control parameters for memory operations in the memory device,to evaluate the accuracy of the data reported by the memory device in aread operation, to detect errors in the data reported by the memorydevice, to post-processing the data reported by the memory device forenhanced accuracy, to improve sequences of operations of the memorydevice for improved data reliability and accuracy and for reducedlatency, etc.

For example, counts measured by calibration circuitry and/or itsassociated data can be used as signal and noise characteristics in thecontroller of a memory sub-system to improve its operations. Further,such signal and noise characteristics can be measured for sub-regions inparallel to reduce the total time for measuring the signal and noisecharacteristics.

FIG. 1 illustrates an example computing system 100 that includes amemory sub-system 110 in accordance with some embodiments of the presentdisclosure. The memory sub-system 110 can include media, such as one ormore volatile memory devices (e.g., memory device 140), one or morenon-volatile memory devices (e.g., memory device 130), or a combinationof such.

A memory sub-system 110 can be a storage device, a memory module, or ahybrid of a storage device and memory module. Examples of a storagedevice include a solid-state drive (SSD), a flash drive, a universalserial bus (USB) flash drive, an embedded Multi-Media Controller (eMMC)drive, a Universal Flash Storage (UFS) drive, a secure digital (SD)card, and a hard disk drive (HDD). Examples of memory modules include adual in-line memory module (DIMM), a small outline DIMM (SO-DIMM), andvarious types of non-volatile dual in-line memory module (NVDIMM).

The computing system 100 can be a computing device such as a desktopcomputer, laptop computer, network server, mobile device, a vehicle(e.g., airplane, drone, train, automobile, or other conveyance),Internet of Things (IoT) enabled device, embedded computer (e.g., oneincluded in a vehicle, industrial equipment, or a networked commercialdevice), or such computing device that includes memory and a processingdevice.

The computing system 100 can include a host system 120 that is coupledto one or more memory sub-systems 110. FIG. 1 illustrates one example ofa host system 120 coupled to one memory sub-system 110. As used herein,“coupled to” or “coupled with” generally refers to a connection betweencomponents, which can be an indirect communicative connection or directcommunicative connection (e.g., without intervening components), whetherwired or wireless, including connections such as electrical, optical,magnetic, etc.

The host system 120 can include a processor chipset (e.g., processingdevice 118) and a software stack executed by the processor chipset. Theprocessor chipset can include one or more cores, one or more caches, amemory controller (e.g., controller 116) (e.g., NVDIMM controller), anda storage protocol controller (e.g., PCIe controller, SATA controller).The host system 120 uses the memory sub-system 110, for example, towrite data to the memory sub-system 110 and read data from the memorysub-system 110.

The host system 120 can be coupled to the memory sub-system 110 via aphysical host interface. Examples of a physical host interface include,but are not limited to, a serial advanced technology attachment (SATA)interface, a peripheral component interconnect express (PCIe) interface,universal serial bus (USB) interface, Fibre Channel, Serial AttachedSCSI (SAS), a double data rate (DDR) memory bus, Small Computer SystemInterface (SCSI), a dual in-line memory module (DIMM) interface (e.g.,DIMM socket interface that supports Double Data Rate (DDR)), etc. Thephysical host interface can be used to transmit data between the hostsystem 120 and the memory sub-system 110. The host system 120 canfurther utilize an NVM Express (NVMe) interface to access components(e.g., memory devices 130) when the memory sub-system 110 is coupledwith the host system 120 by the PCIe interface. The physical hostinterface can provide an interface for passing control, address, data,and other signals between the memory sub-system 110 and the host system120. FIG. 1 illustrates a memory sub-system 110 as an example. Ingeneral, the host system 120 can access multiple memory sub-systems viaa same communication connection, multiple separate communicationconnections, and/or a combination of communication connections.

The processing device 118 of the host system 120 can be, for example, amicroprocessor, a central processing unit (CPU), a processing core of aprocessor, an execution unit, etc. In some instances, the controller 116can be referred to as a memory controller, a memory management unit,and/or an initiator. In one example, the controller 116 controls thecommunications over a bus coupled between the host system 120 and thememory sub-system 110. In general, the controller 116 can send commandsor requests to the memory sub-system 110 for desired access to memorydevices 130,140. The controller 116 can further include interfacecircuitry to communicate with the memory sub-system 110. The interfacecircuitry can convert responses received from memory sub-system 110 intoinformation for the host system 120.

The controller 116 of the host system 120 can communicate withcontroller 115 of the memory sub-system 110 to perform operations suchas reading data, writing data, or erasing data at the memory devices130,140 and other such operations. In some instances, the controller 116is integrated within the same package of the processing device 118. Inother instances, the controller 116 is separate from the package of theprocessing device 118. The controller 116 and/or the processing device118 can include hardware such as one or more integrated circuits (ICs)and/or discrete components, a buffer memory, a cache memory, or acombination thereof. The controller 116 and/or the processing device 118can be a microcontroller, special purpose logic circuitry (e.g., a fieldprogrammable gate array (FPGA), an application specific integratedcircuit (ASIC), etc.), or another suitable processor.

The memory devices 130, 140 can include any combination of the differenttypes of non-volatile memory components and/or volatile memorycomponents. The volatile memory devices (e.g., memory device 140) canbe, but are not limited to, random access memory (RAM), such as dynamicrandom access memory (DRAM) and synchronous dynamic random access memory(SDRAM).

Some examples of non-volatile memory components include a negative-and(NAND) type flash memory and write-in-place memory, such asthree-dimensional cross-point (“3D cross-point”) memory. A cross-pointarray of non-volatile memory can perform bit storage based on a changeof bulk resistance, in conjunction with a stackable cross-gridded dataaccess array. Additionally, in contrast to many flash-based memories,cross-point non-volatile memory can perform a write in-place operation,where a non-volatile memory cell can be programmed without thenon-volatile memory cell being previously erased. NAND type flash memoryincludes, for example, two-dimensional NAND (2D NAND) andthree-dimensional NAND (3D NAND).

Each of the memory devices 130 can include one or more arrays of memorycells. One type of memory cell, for example, single level cells (SLC)can store one bit per cell. Other types of memory cells, such asmulti-level cells (MLCs), triple level cells (TLCs), and quad-levelcells (QLCs), can store multiple bits per cell. In some embodiments,each of the memory devices 130 can include one or more arrays of memorycells such as SLCs, MLCs, TLCs, QLCs, or any combination of such. Insome embodiments, a particular memory device can include an SLC portion,and an MLC portion, a TLC portion, or a QLC portion of memory cells. Thememory cells of the memory devices 130 can be grouped as pages that canrefer to a logical unit of the memory device used to store data. Withsome types of memory (e.g., NAND), pages can be grouped to form blocks.

Although non-volatile memory devices such as 3D cross-point type andNAND type memory (e.g., 2D NAND, 3D NAND) are described, the memorydevice 130 can be based on any other type of non-volatile memory, suchas read-only memory (ROM), phase change memory (PCM), self-selectingmemory, other chalcogenide based memories, ferroelectric transistorrandom-access memory (FeTRAM), ferroelectric random access memory(FeRAM), magneto random access memory (MRAM), Spin Transfer Torque(STT)-MRAM, conductive bridging RAM (CBRAM), resistive random accessmemory (RRAM), oxide based RRAM (OxRAM), negative-or (NOR) flash memory,and electrically erasable programmable read-only memory (EEPROM).

A memory sub-system controller 115 (or controller 115 for simplicity)can communicate with the memory devices 130 to perform operations suchas reading data, writing data, or erasing data at the memory devices 130and other such operations (e.g., in response to commands scheduled on acommand bus by controller 116). The controller 115 can include hardwaresuch as one or more integrated circuits (ICs) and/or discretecomponents, a buffer memory, or a combination thereof. The hardware caninclude digital circuitry with dedicated (i.e., hard-coded) logic toperform the operations described herein. The controller 115 can be amicrocontroller, special purpose logic circuitry (e.g., a fieldprogrammable gate array (FPGA), an application specific integratedcircuit (ASIC), etc.), or another suitable processor.

The controller 115 can include a processing device 117 (processor)configured to execute instructions stored in a local memory 119. In theillustrated example, the local memory 119 of the controller 115 includesan embedded memory configured to store instructions for performingvarious processes, operations, logic flows, and routines that controloperation of the memory sub-system 110, including handlingcommunications between the memory sub-system 110 and the host system120.

In some embodiments, the local memory 119 can include memory registersstoring memory pointers, fetched data, etc. The local memory 119 canalso include read-only memory (ROM) for storing micro-code. While theexample memory sub-system 110 in FIG. 1 has been illustrated asincluding the controller 115, in another embodiment of the presentdisclosure, a memory sub-system 110 does not include a controller 115,and can instead rely upon external control (e.g., provided by anexternal host, or by a processor or controller separate from the memorysub-system).

In general, the controller 115 can receive commands or operations fromthe host system 120 and can convert the commands or operations intoinstructions or appropriate commands to achieve the desired access tothe memory devices 130. The controller 115 can be responsible for otheroperations such as wear leveling operations, garbage collectionoperations, error detection and error-correcting code (ECC) operations,encryption operations, caching operations, and address translationsbetween a logical address (e.g., logical block address (LBA), namespace)and a physical address (e.g., physical block address) that areassociated with the memory devices 130. The controller 115 can furtherinclude host interface circuitry to communicate with the host system 120via the physical host interface. The host interface circuitry canconvert the commands received from the host system into commandinstructions to access the memory devices 130 as well as convertresponses associated with the memory devices 130 into information forthe host system 120.

The memory sub-system 110 can also include additional circuitry orcomponents that are not illustrated. In some embodiments, the memorysub-system 110 can include a cache or buffer (e.g., DRAM) and addresscircuitry (e.g., a row decoder and a column decoder) that can receive anaddress from the controller 115 and decode the address to access thememory devices 130.

In some embodiments, the memory devices 130 include local mediacontrollers 150 that operate in conjunction with memory sub-systemcontroller 115 to execute operations on one or more memory cells of thememory devices 130. An external controller (e.g., memory sub-systemcontroller 115) can externally manage the memory device 130 (e.g.,perform media management operations on the memory device 130). In someembodiments, a memory device 130 is a managed memory device, which is araw memory device combined with a local controller (e.g., localcontroller 150) for media management within the same memory devicepackage. An example of a managed memory device is a managed NAND (MNAND)device.

The controller 115 can include a performance manager 113 that canenhance the performance of the memory sub-system 110 using signal andnoise characteristics measured by the memory devices 130 for memorycells in the respective memory devices 130. In some embodiments, thecontroller 115 in the memory sub-system 110 includes at least a portionof the performance manager 113. In other embodiments, or in combination,the controller 116 and/or the processing device 118 in the host system120 includes at least a portion of the performance manager 113. Forexample, the controller 115, the controller 116, and/or the processingdevice 118 can include logic circuitry implementing the performancemanager 113. For example, the controller 115, or the processing device118 (processor) of the host system 120, can be configured to executeinstructions stored in memory for performing the operations of theperformance manager 113 described herein. In some embodiments, theperformance manager 113 is implemented in an integrated circuit chipdisposed in the memory sub-system 110. In other embodiments, theperformance manager 113 can be part of firmware of the memory sub-system110, an operating system of the host system 120, a device driver, or anapplication, or any combination therein.

The performance manager 113 can receive signal and noise characteristicsmeasured and provided by a memory device 130 for the memory cells in thememory device 130 and process the signal and noise characteristics togenerate parameters for improved operations of the memory device 130, todetect and/or correct errors in data retrieved and reported by thememory device 130 from its memory cells, and/or to schedule operationsfor improved data accuracy and reliability, as further discussed below.

FIG. 2 illustrates an integrated circuit memory device 130 having acalibration circuit 145 configured to measure signal and noisecharacteristics according to one embodiment. For example, the memorydevices 130 in the memory sub-system 110 of FIG. 1 can be implementedusing the integrated circuit memory device 130 of FIG. 2.

The integrated circuit memory device 130 can be enclosed in a singleintegrated circuit package. The integrated circuit memory device 130includes multiple groups 131, . . . , 133 of memory cells that can beformed in one or more integrated circuit dies. A typical memory cell ina group 131, . . . , 133 can be programmed to store one or more bits ofdata.

Some of the memory cells in the integrated circuit memory device 130 canbe configured to be operated together for a particular type ofoperations. For example, memory cells on an integrated circuit die canbe organized in planes, blocks, and pages. A plane contains multipleblocks; a block contains multiple pages; and a page can have multiplestrings of memory cells. For example, an integrated circuit die can bethe smallest unit that can independently execute commands or reportstatus; identical, concurrent operations can be executed in parallel onmultiple planes in an integrated circuit die; a block can be thesmallest unit to perform an erase operation; and a page can be thesmallest unit to perform a data program operation (to write data intomemory cells). Each string has its memory cells connected to a commonbitline; and the control gates of the memory cells at the same positionsin the strings in a block or page are connected to a common wordline.Control signals can be applied to wordlines and bitlines to address theindividual memory cells.

The integrated circuit memory device 130 has a communication interface147 to receive an address 135 from the controller 115 of a memorysub-system 110 and to provide the data 137 retrieved from the memoryaddress 135. An address decoder 141 of the integrated circuit memorydevice 130 converts the address 135 into control signals to select thememory cells in the integrated circuit memory device 130; and aread/write circuit 143 of the integrated circuit memory device 130performs operations to determine data stored in the addressed memorycells or to program the memory cells to have states corresponding tostoring the data 137.

The integrated circuit memory device 130 has a calibration circuit 145configured to determine measurements of signal and noise characteristics139 of memory cells in a group (e.g., 131, . . . , or 133) and providethe signal and noise characteristics 139 to the controller 115 of amemory sub-system 110 via the communication interface 147.

In at least some embodiments, the calibration circuit 145 also provides,to the controller 115 via the communication interface 147, the signaland noise characteristics 139 measured to determine the read leveloffset value. In some embodiments, the read level offset value can beused to understand, quantify, or estimate the signal and noisecharacteristics 139. In other embodiments, the statistics of memorycells in a group or region that has a particular state at one or moretest voltages can be provided as the signal and noise characteristics139.

For example, the calibration circuit 145 can measure the signal andnoise characteristics 139 by reading different responses from the memorycells in a group (e.g., 131, . . . , 133) by varying operatingparameters used to read the memory cells, such as the voltage(s) appliedduring an operation to read data from memory cells.

For example, the calibration circuit 145 can measure the signal andnoise characteristics 139 on the fly when executing a command to readthe data 137 from the address 135. Since the signal and noisecharacteristics 139 is measured as part of the operation to read thedata 137 from the address 135, the signal and noise characteristics 139can be provided from the integrated circuit memory device 130 to thecontroller 115 with reduced or no penalty on the latency in theexecution of the command to read the data 137 from the address 135.

The performance manager 113 of the controller 115 of the memorysub-system 110 is configured to use the signal and noise characteristics139 to enhance the performance of the memory sub-system 110.

For example, the performance manager 113 can use the signal and noisecharacteristics 139 of a group of memory cells under differentconditions to generate a model for determining optimized parameters toread data from the group of memory cells under various conditions.

For example, the performance manager 113 can use the signal and noisecharacteristics 139 of different groups of memory cells to generate amodel of memory cells in the memory device 130 in predicting thebehavior of memory cell groups.

FIG. 3 shows an example of measuring signal and noise characteristics139 to improve memory read operations according to one embodiment.

In FIG. 3, the calibration circuit 145 applies different read voltagesV_(A), V_(B), V_(C), V_(D), and V_(E) to read the states of memory cellsin a group (e.g., 131, . . . , or 133). In general, more or less readvoltages can be used to generate the signal and noise characteristics139.

As a result of the different voltages applied during the read operation,a same memory cell in the group (e.g., 131, . . . , or 133) may showdifferent states. Thus, the counts C_(A), C_(B), C_(C), C_(D), and C_(E)of memory cells having a predetermined state at different read voltagesV_(A), V_(B), V_(C), V_(D), and V_(E) can be different in general. Thepredetermined state can be a state of having substantial current passingthrough the memory cells, or a state of having no substantial currentpassing through the memory cells. The counts C_(A), C_(B), C_(C), C_(D),and C_(E) can be referred to as bit counts.

The calibration circuit 145 can measure the bit counts by applying theread voltages V_(A), V_(B), V_(C), V_(D), and V_(E) one at a time on thegroup (e.g., 131, . . . , or 133) of memory cells.

Alternatively, the group (e.g., 131, . . . , or 133) of memory cells canbe configured as multiple subgroups; and the calibration circuit 145 canmeasure the bit counts of the subgroups in parallel by applying the readvoltages V_(A), V_(B), V_(C), V_(D), and V_(E). The bit counts of thesubgroups are considered as representative of the bit counts in theentire group (e.g., 131, . . . , or 133). Thus, the time duration ofobtaining the counts C_(A), C_(B), C_(C), C_(D), and C_(E) can bereduced.

In some embodiments, the bit counts C_(A), C_(B), C_(C), C_(D), andC_(E) are measured during the execution of a command to read the data137 from the address 135 that is mapped to one or more memory cells inthe group (e.g., 131, . . . , or 133). Thus, the controller 115 does notneed to send a separate command to request for the signal and noisecharacteristics 139 that is based on the bit counts C_(A), C_(B), C_(C),C_(D), and C_(E).

The differences between the bit counts of the adjacent voltages areindicative of the errors in reading the states of the memory cells inthe group (e.g., 133, . . . , or 133).

For example, the count difference D_(A) is calculated from C_(A)−C_(B),which is an indication of read error introduced by changing the readvoltage from V_(A) to V_(B).

Similarly, D_(B)=C_(B)−C_(C); D_(C)=C_(C)−C_(D); and D_(D)=C_(D)−C_(E).

The curve 157, obtained based on the count differences D_(A), D_(B),D_(C), and D_(D), represents the prediction of read error E as afunction of the read voltage. From the curve 157 (and/or the countdifferences), the optimized read voltage V_(O) can be calculated as thepoint 153 that provides the lowest read error D_(MIN) on the curve 157.

In one embodiment, the calibration circuit 145 computes the optimizedread voltage V_(O) and causes the read/write circuit 143 to read thedata 137 from the address 135 using the optimized read voltage V_(O).

Alternatively, the calibration circuit 145 can provide, via thecommunication interface 147 to the controller 115 of the memorysub-system 110, the count differences D_(A), D_(B), D_(C), and D_(D)and/or the optimized read voltage V_(O) calculated by the calibrationcircuit 145.

FIG. 3 illustrates an example of generating a set of statistical data(e.g., bit counts and/or count differences) for reading at an optimizedread voltage V_(O). In general, a group of memory cells can beconfigured to store more than one bit in a memory cell; and multipleread voltages are used to read the data stored in the memory cells. Aset of statistical data can be similarly measured for each of the readvoltages to identify the corresponding optimize read voltage, where thetest voltages in each set of statistical data are configured in thevicinity of the expected location of the corresponding optimized readvoltage. Thus, the signal and noise characteristics 139 measured for amemory cell group (e.g., 131 or 133) can include multiple sets ofstatistical data measured for the multiple threshold voltagesrespectively.

FIG. 4 illustrates a controller 115 of a memory sub-system 110 obtainingsignal and noise characteristics 139 from a memory device 130 forenhanced operations of the memory device 130 according to oneembodiment. For example, the memory device 130 in FIG. 4 can beimplemented using the integrated circuit memory device 130 of FIG. 2;and interactions between the controller 115 and the memory devices 130can be implemented according to FIG. 4.

In FIG. 4, the controller 115 can instruct the memory device 130 toperform a read operation by providing an address 135 and at least oneread control parameter 161. For example, the read control parameter 161can be a suggested read voltage.

The memory device 130 can perform the read operation by determining thestates of memory cells at the address 135 at a read voltage and providethe data 137 according to the determined states.

During the read operation, the calibration circuit 145 of the memorydevice 130 generates the signal and noise characteristics 139. The data137 and the signal and noise characteristics 139 are provided from thememory device 130 to the controller 115 as a response. Alternatively,the processing of the signal and noise characteristics 139 can beperformed at least in part using logic circuitry configured in thememory device 130. For example, the performance manager 113 can beimplemented partially or entirely using the processing logic configuredin the memory device 130.

The signal and noise characteristics 139 can be determined based atleast in part on the read control parameter 161. For example, when theread control parameter 161 is a suggested read voltage for reading thememory cells at the address 135, the calibration circuit 145 can computethe read voltages V_(A), V_(B), V_(C), V_(D), and V_(E) that are in thevicinity of the suggested read voltage.

The signal and noise characteristics 139 can include the bit countsC_(A), C_(B), C_(C), C_(D), and C_(E). Alternatively, or in combination,the signal and noise characteristics 139 can include the countdifferences D_(A), D_(B), D_(C), D_(D), and D_(E).

Optionally, the calibration circuit 145 uses one method to compute anoptimized read voltage V_(O) from the count differences D_(A), D_(B),D_(C), D_(D), and D_(E); and the performance manager 113 of thecontroller 115 uses another different method to compute the optimizedread voltage V_(O) from the signal and noise characteristics 139 andoptionally other data that is not available to the calibration circuit145.

When the calibration circuit 145 can compute the optimized read voltageV_(O) from the count differences D_(A), D_(B), D_(C), D_(D), and D_(E)generated during the read operation, the signal and noisecharacteristics can optionally include the optimized read voltage V_(O).Further, the memory device 130 can use the optimized read voltage V_(O)in determining the data 137 from the memory cells at the address 135.Alternatively, the memory device 130 uses the suggested read voltage inthe read control parameter 161 in reading the data 137.

The controller 115 can be configured with more processing power than thecalibration circuit 145 of the integrated circuit memory device 130.Further, the controller 115 can have other signal and noisecharacteristics applicable to the memory cells in the group (e.g., 133,. . . , or 133). Thus, in general, the controller 115 can compute a moreaccurate estimation of the optimized read voltage V_(O) (e.g., for asubsequent read operation, or for a retry of the read operation).

Optionally, the performance manager 113 of the controller 115 canidentify, based on the signal and noise characteristics 139, a programfailure in data being programmed in the memory cells of the memorydevice 130. For example, without the signal and noise characteristics139, the controller 115 would have to try to decode data 137 retrievedfrom a page in the memory device 130 and try error handling operations.After failing to recover from errors, the controller 115 can positivelyidentify the program failure in the data 137 received from the memorydevice 130. However, when the program failure is identified from thesignal and noise characteristics 139, the controller 115 can bypass theoperations of attempting to decode the data 137 and the operations oferror handling. In some instances, the controller 115 may analyze thesignature of unrecoverable data 137 to infer program failure. However,the signal and noise characteristics 139 from the memory device 130 canallow positive identification of program failure.

In general, it is not necessary for the calibration circuit 145 toprovide the signal and noise characteristics 139 in the form of adistribution of bit counts over a set of read voltages, or in the formof a distribution of count differences over a set of read voltages. Forexample, the calibration circuit 145 can provide the optimized readvoltage V_(O) calculated by the calibration circuit 145, as signal andnoise characteristics 139, which allows the controller 115 of the memorysub-system 110 to observe shifts in the optimized read voltage as afunction of one or more factors, such as cross temperature effect, readdisturb (RD), program/erase (PE), or data retention (DR), etc. Theobserve shifts can be used in the controller 115 to build a predictivemodel of the behavior of the memory cells in the memory device 130 andthus improve the operations of the memory device 130 based on thepredictive model. For example, the controller can predict a currentoptimized read voltage for a read command and instruct the memory device130 to perform the command to read the data 137 at the address 135 usingthe read voltage predicted using the predictive model.

The calibration circuit 145 can be configured to generate the signal andnoise characteristics 139 (e.g., the bit counts, or bit countdifferences) as a byproduct of a read operation. The generation of thesignal and noise characteristics 139 can be implemented in theintegrated circuit memory device 130 with little or no impact on thelatency of the read operation in comparison with a typical read withoutthe generation of the signal and noise characteristics 139.

In some embodiments, the signal and noise characteristics 139 generatedin one read operation may not be enough for the calibration circuit 145to identify an optimal read voltage. For example, a bit count C can bedetermined for one or more read voltages V_(A), V_(B), V_(C), V_(D),and/or V_(E) during one read operation. The entire set of bit countsC_(A), C_(B), C_(C), C_(D), and C_(E) can be determined from two or moreread operations for the same group (e.g., 131 or 133) of memory cells.When the bit count for multiple read voltages is determined in one readoperation, the calibration circuit 145 can apply the different readvoltages to multiple subgroups in parallel to obtain the bit counts ofthe subgroups and infer the corresponding counts for the entire group(e.g., 131 or 133) based on the assumption that the data distribution inthe subgroups is similar or the same in the entire group (e.g., 131 or133). The performance manager 113 uses the bit counts C_(A), C_(B),C_(C), C_(D), and C_(E) collected over two or more read operations forthe same group (e.g., 131 or 133) of memory cells to calculate theoptimized read voltage V_(O) 151. Subsequently, the controller 115 caninstruct the memory device 130 to use the optimized read voltage V_(O)151 to read data from the group (e.g., 131 or 133) of memory cells.

In some embodiment, in calculating the optimized read voltage V_(O) 151,the performance manager 113 uses not only the bit counts C_(A), C_(B),C_(C), C_(D), and C_(E) collected over one or more read operations forthe same group (e.g., 131 or 133) of memory cells, but also informationabout cross-temperature effect, read disturb (RD), program/erase (PE),or data retention (DR).

Optionally, the performance manager 113 correlates the optimized readvoltage V_(O) 151, determined by the performance manager 113 and/or thecalibration circuit 145, with cross-temperature effect, read disturb(RD), program/erase (PE), or data retention (DR) to improve a predictivemodel of optimized read voltage for an integrated circuit die.

Thus, the calibration circuit 145 can determine signal and noisecharacteristics 139 efficiently as a byproduct of performing a readoperation according to a command from the controller 115 of the memorysub-system 110; and the performance manager 113 of the controller 115can improve signal processing in the memory sub-system 110 using thesignal and noise characteristics 139.

Optionally, the performance manager 113 of the controller 115 can usethe signal and noise characteristics 139 provided by the memory device130 for each read operation of a given page-type to adjust/update theoptimized read voltage V_(O) for the page-type. Furthermore, such anupdate/adjustment can be performed for each host read and possible nobackground reads, or reduced background reads.

After a number of leading read operations, each subsequent readoperation can generate addition signal and noise characteristics 139that can be combined with signal and noise characteristics obtained in anumber of immediate prior read operations to calculate the updatedoptimized read voltage V_(O).

In general, the calculation of the optimized read voltage V_(O) can beperformed within the memory device 130, or by a controller 115 of thememory sub-system 111 that receives the signal and noise characteristics139 as part of enriched status response from the memory device 130.

Since the signal and noise characteristics 139 is collected with littleor no impact on individual read operations, the optimized read voltageV_(O) can be calibrated over the time continuously to prevent asubstantial jump in the optimal voltage. Thus, the overall performanceof the memory sub-system 110 over a period of time can be improved.

In general, the signal and noise characteristics 139 obtained by thecontroller 115 from the memory device 130 is not limited to the trackingof optimized read voltages. For example, the controller 115 can uses usethe relation between the adjustments in optimized read voltages as afunction of operating temperature to model the margin loss fromcross-temperature effects. Similarly, by observing the amount ofretention shift over time, the controller 115 can infer the actualhealth of the memory cells in the memory device 130, such as the amountof damage the memory cells have suffered from repeated erase/programcycles.

FIG. 5 shows a method of a memory sub-system 110 enhancing memoryoperations using signal and noise characteristics 139 from a memorydevice 130. The method of FIG. 5 can be performed by processing logicthat can include hardware (e.g., processing device, circuitry, dedicatedlogic, programmable logic, microcode, hardware of a device, integratedcircuit, etc.), software/firmware (e.g., instructions run or executed ona processing device), or a combination thereof. In some embodiments, themethod of FIG. 5 is performed at least in part by the controller 115 ofFIG. 1, or 4. Although shown in a particular sequence or order, unlessotherwise specified, the order of the processes can be modified. Thus,the illustrated embodiments should be understood only as examples, andthe illustrated processes can be performed in a different order, andsome processes can be performed in parallel. Additionally, one or moreprocesses can be omitted in various embodiments. Thus, not all processesare required in every embodiment. Other process flows are possible.

For example, the method of FIG. 5 can be implemented in a computingsystem of FIG. 1 with a memory device of FIG. 2 and signal noisecharacteristics illustrated in FIG. 3 in interactions between acontroller and a memory device illustrated in FIG. 4.

At block 301, a processing device 117 in a memory sub-system 110transmits a command to a memory device (e.g., 130) of the memorysub-system 110 to retrieve data 137 from an address 135.

For example, the memory device 130 is enclosed in an integrated circuitpackage; and a calibration circuit 145 can be formed at least in part onthe integrated circuit die.

At block 303, in response to the command and during the execution of thecommand, a calibration circuit 145 of the memory device 130 measuressignal and noise characteristics 139 of a group (e.g., 131 or 133) ofmemory cells formed on an integrated circuit die.

At block 305, the processing device 117 receives from the memory device130 the signal and noise characteristics 139 that are measured by thecalibration circuit 145 during the execution of the command.

At block 307, the processing device 117 of the memory sub-system 110processes the signal and noise characteristics. Alternatively, or incombination, processing logic configured in the memory device 130 canprocess the signal and noise characteristics.

At block 309, the processing device 117 of the memory sub-system 110identifies an attribute about the memory device 130 based the processing307 of the signal and noise characteristics 139.

At block 311, the memory sub-system 110 performs an operation related todata stored in the memory device 130 based on the attribute.

For example, the signal and noise characteristics 139 can include acount (e.g., V_(A)) of memory cells in the group having a predeterminedstate (e.g., conductive or non-conductive) when a read voltage (e.g.,V_(A)) is applied on the group of memory cells.

For example, the signal and noise characteristics 139 can include adifference (e.g., D_(A)) between a first count (e.g., C_(A)) of memorycells in the group having a predetermined state when a first readvoltage (e.g., V_(A)) is applied on the group of memory cells and asecond count (e.g., C_(B)) of memory cells in the group having thepredetermined state when a second read voltage (e.g., V_(B)) is appliedon the group of memory cells.

For example, the signal and noise characteristics 139 can includestatistic data (e.g., bit counts and/or count differences) of memorycells at varying operating parameters (e.g., read voltages).

For example, the signal and noise characteristics 139 can include afirst optimized read voltage V_(O) calculated by the calibration circuit145 of the memory device 130; and the attribute can include a secondoptimized read voltage V_(O) calculated by the processing device 117using at least the signal and noise characteristics 139.

For example, the calibration circuit 145 and the processing device 117can calculate the optimized read voltage V_(O) using different methods,different data sets, and/or for different conditions to operate thememory device 130.

For example, the first optimized read voltage V_(O) can be calculated bythe calibration circuit 145 using a first method; and the secondoptimized read voltage V_(O) can be calculated by the processing device117 using a second method different from the first method.

For example, the second optimized read voltage V_(O) is calculated basedon information not available in the memory device 130 during theexecution of the command in the memory device 130, such as furthersignal and noise characteristics generated by the calibration circuit145 during the execution of one or more prior commands.

In some embodiments, the signal and noise characteristics 139 measuredduring the execution of the command in the memory device 130 may not beenough for the memory device 130 to calculate the first optimized readvoltage V_(O); and the processing device 117 can use accumulated signaland noise characteristics 139 measured during the execution of multiplecommands in the memory device 130 to calculate the second optimized readvoltage V_(O). In other embodiments, the memory device 130 is alsocapable of accumulating signal and noise characteristics 139 measuredduring the execution of multiple commands in the memory device 130 tocalculate the first optimized read voltage V_(O).

For example, the processing device 117 can use information not availablein the memory device during the execution of the command to calculatesecond optimized read voltage V_(O). Such information can include datarelevant to charge loss, read disturb, cross-temperature effect, dataretention, or program/erase, or any combination thereof.

For example, the attribute identified based at least in part on thesignal and noise characteristics 139 can include a predictive model. Forexample, the predictive model can be obtained by observing the change ofthe optimized read voltage V_(O) as a function of one or more factors,such as cross-temperature effect, read disturb, program/erase, or dataretention, or any combination thereof.

For example, the attribute identified based at least in part on thesignal and noise characteristics 139 can include a determination ofprogram failure in the data 137 that is retrieved by the memory device130 from the address in response to the command; and the operationperformed 311 based on the attribute can include skipping decoding thedata, and/or skipping recovering from errors in the data 137.

For example, the attribute identified based at least in part on thesignal and noise characteristics 139 can include a predictive model ofan optimized read voltage as a function of one or more factors.

In general, the signal and noise characteristics 139 can includestatistics of memory cells in the group (e.g., 131 or 133) operated atdifferent levels of a parameter for reading the memory cells.

In another example, the attribute identified based at least in part onthe signal and noise characteristics 139 can include an indication of anamount of damage the memory device 130 has as a result of repeatedprogram/erase cycles.

In a further example, the attribute identified based at least in part onthe signal and noise characteristics 139 can include an indication ofmargin loss from cross-temperature effect based on tracking shifting ofoptimized read voltage as a function of operating temperature.

In yet another example, the attribute identified based at least in parton the signal and noise characteristics 139 can include an estimate ofthe bit error rate of the data 137 retrieved from the memory cells. Thedata 137 can be in an encoded form that allows error detection and/orrecovery via Error Correction Code (ECC), Low-Density Parity-Check(LDPC) code, etc. If the estimate of the bit error rate indicates thatthe data 137 will fail to decode, the memory sub-system 110 can skip theattempt to decode the data 137, skip transmitting the data 137 to adecoder, skip transmitting the data 137 from the memory device 130 tothe controller 115, and/or skip reading the data 137 from memory cellsusing the currently known read voltage(s).

The performance manager 113 can include instructions configured assoftware and/or firmware. For example, the processing device 117 canexecute the instructions of the performance manager 113 to perform theabove discussed methods. Further, some or all the operations of theperformance manager 113 discussed above can be implemented viaprocessing logic configured within the memory device 130 (e.g., toreduce the data communication between the memory device 130 and thecontroller 115 of the memory sub-system 110). For example, theprocessing logic can be implemented using Complementarymetal-oxide-semiconductor (CMOS) circuitry formed under the array ofmemory cells on an integrated circuit die of the memory device 130. Forexample, the processing logic can be formed, within the integratedcircuit package of the memory device 130, on a separate integratedcircuit die that is connected to the integrated circuit die having thememory cells using Through-Silicon Vias (TSVs) and/or other connectiontechniques.

A non-transitory computer storage medium can be used to storeinstructions of the firmware of a memory sub-system (e.g., 113). Whenthe instructions are executed by the controller 115 and/or theprocessing device 117, the instructions cause the controller 115 and/orthe processing device 117 to perform the methods discussed above.

FIG. 6 illustrates an example machine of a computer system 400 withinwhich a set of instructions, for causing the machine to perform any oneor more of the methodologies discussed herein, can be executed. In someembodiments, the computer system 400 can correspond to a host system(e.g., the host system 120 of FIG. 1) that includes, is coupled to, orutilizes a memory sub-system (e.g., the memory sub-system 110 of FIG. 1)or can be used to perform the operations of a performance manager 113(e.g., to execute instructions to perform operations corresponding tothe performance manager 113 described with reference to FIGS. 1-5). Inalternative embodiments, the machine can be connected (e.g., networked)to other machines in a LAN, an intranet, an extranet, and/or theInternet. The machine can operate in the capacity of a server or aclient machine in client-server network environment, as a peer machinein a peer-to-peer (or distributed) network environment, or as a serveror a client machine in a cloud computing infrastructure or environment.

The machine can be a personal computer (PC), a tablet PC, a set-top box(STB), a Personal Digital Assistant (PDA), a cellular telephone, a webappliance, a server, a network router, a switch or bridge, or anymachine capable of executing a set of instructions (sequential orotherwise) that specify actions to be taken by that machine. Further,while a single machine is illustrated, the term “machine” shall also betaken to include any collection of machines that individually or jointlyexecute a set (or multiple sets) of instructions to perform any one ormore of the methodologies discussed herein.

The example computer system 400 includes a processing device 402, a mainmemory 404 (e.g., read-only memory (ROM), flash memory, dynamic randomaccess memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM(RDRAM), static random access memory (SRAM), etc.), and a data storagesystem 418, which communicate with each other via a bus 430 (which caninclude multiple buses).

Processing device 402 represents one or more general-purpose processingdevices such as a microprocessor, a central processing unit, or thelike. More particularly, the processing device can be a complexinstruction set computing (CISC) microprocessor, reduced instruction setcomputing (RISC) microprocessor, very long instruction word (VLIW)microprocessor, or a processor implementing other instruction sets, orprocessors implementing a combination of instruction sets. Processingdevice 402 can also be one or more special-purpose processing devicessuch as an application specific integrated circuit (ASIC), a fieldprogrammable gate array (FPGA), a digital signal processor (DSP),network processor, or the like. The processing device 402 is configuredto execute instructions 426 for performing the operations and stepsdiscussed herein. The computer system 400 can further include a networkinterface device 408 to communicate over the network 420.

The data storage system 418 can include a machine-readable storagemedium 424 (also known as a computer-readable medium) on which is storedone or more sets of instructions 426 or software embodying any one ormore of the methodologies or functions described herein. Theinstructions 426 can also reside, completely or at least partially,within the main memory 404 and/or within the processing device 402during execution thereof by the computer system 400, the main memory 404and the processing device 402 also constituting machine-readable storagemedia. The machine-readable storage medium 424, data storage system 418,and/or main memory 404 can correspond to the memory sub-system 110 ofFIG. 1.

In one embodiment, the instructions 426 include instructions toimplement functionality corresponding to a performance manager 113(e.g., the performance manager 113 described with reference to FIGS.1-5). While the machine-readable storage medium 424 is shown in anexample embodiment to be a single medium, the term “machine-readablestorage medium” should be taken to include a single medium or multiplemedia that store the one or more sets of instructions. The term“machine-readable storage medium” shall also be taken to include anymedium that is capable of storing or encoding a set of instructions forexecution by the machine and that cause the machine to perform any oneor more of the methodologies of the present disclosure. The term“machine-readable storage medium” shall accordingly be taken to include,but not be limited to, solid-state memories, optical media, and magneticmedia.

Some portions of the preceding detailed descriptions have been presentedin terms of algorithms and symbolic representations of operations ondata bits within a computer memory. These algorithmic descriptions andrepresentations are the ways used by those skilled in the dataprocessing arts to most effectively convey the substance of their workto others skilled in the art. An algorithm is here, and generally,conceived to be a self-consistent sequence of operations leading to adesired result. The operations are those requiring physicalmanipulations of physical quantities. Usually, though not necessarily,these quantities take the form of electrical or magnetic signals capableof being stored, combined, compared, and otherwise manipulated. It hasproven convenient at times, principally for reasons of common usage, torefer to these signals as bits, values, elements, symbols, characters,terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar termsare to be associated with the appropriate physical quantities and aremerely convenient labels applied to these quantities. The presentdisclosure can refer to the action and processes of a computer system,or similar electronic computing device, that manipulates and transformsdata represented as physical (electronic) quantities within the computersystem's registers and memories into other data similarly represented asphysical quantities within the computer system memories or registers orother such information storage systems.

The present disclosure also relates to an apparatus for performing theoperations herein. This apparatus can be specially constructed for theintended purposes, or it can include a general purpose computerselectively activated or reconfigured by a computer program stored inthe computer. Such a computer program can be stored in a computerreadable storage medium, such as, but not limited to, any type of diskincluding floppy disks, optical disks, CD-ROMs, and magnetic-opticaldisks, read-only memories (ROMs), random access memories (RAMs), EPROMs,EEPROMs, magnetic or optical cards, or any type of media suitable forstoring electronic instructions, each coupled to a computer system bus.

The algorithms and displays presented herein are not inherently relatedto any particular computer or other apparatus. Various general purposesystems can be used with programs in accordance with the teachingsherein, or it can prove convenient to construct a more specializedapparatus to perform the method. The structure for a variety of thesesystems will appear as set forth in the description below. In addition,the present disclosure is not described with reference to any particularprogramming language. It will be appreciated that a variety ofprogramming languages can be used to implement the teachings of thedisclosure as described herein.

The present disclosure can be provided as a computer program product, orsoftware, that can include a machine-readable medium having storedthereon instructions, which can be used to program a computer system (orother electronic devices) to perform a process according to the presentdisclosure. A machine-readable medium includes any mechanism for storinginformation in a form readable by a machine (e.g., a computer). In someembodiments, a machine-readable (e.g., computer-readable) mediumincludes a machine (e.g., a computer) readable storage medium such as aread only memory (“ROM”), random access memory (“RAM”), magnetic diskstorage media, optical storage media, flash memory components, etc.

In this description, various functions and operations are described asbeing performed by or caused by computer instructions to simplifydescription. However, those skilled in the art will recognize what ismeant by such expressions is that the functions result from execution ofthe computer instructions by one or more controllers or processors, suchas a microprocessor. Alternatively, or in combination, the functions andoperations can be implemented using special purpose circuitry, with orwithout software instructions, such as using Application-SpecificIntegrated Circuit (ASIC) or Field-Programmable Gate Array (FPGA).Embodiments can be implemented using hardwired circuitry withoutsoftware instructions, or in combination with software instructions.Thus, the techniques are limited neither to any specific combination ofhardware circuitry and software, nor to any particular source for theinstructions executed by the data processing system.

In the foregoing specification, embodiments of the disclosure have beendescribed with reference to specific example embodiments thereof. Itwill be evident that various modifications can be made thereto withoutdeparting from the broader spirit and scope of embodiments of thedisclosure as set forth in the following claims. The specification anddrawings are, accordingly, to be regarded in an illustrative senserather than a restrictive sense.

What is claimed is:
 1. A memory sub-system, comprising: a processingdevice; and at least one memory component, the memory component beingenclosed in an integrated circuit package, the memory component having:a group of memory cells formed on an integrated circuit die; and acalibration circuit; wherein the processing device is configured totransmit a command to the memory component to retrieve data from anaddress; wherein in response to the command and during execution of thecommand, the calibration circuit is configured to measure signal andnoise characteristics of the group of memory cells; wherein the memorycomponent is configured to provide the signal and noise characteristicsto the processing device; and wherein the processing device isconfigured to process the signal and noise characteristics to identifyan attribute about the memory component and perform an operation relatedto data stored in the memory component based on the attribute.
 2. Thememory sub-system of claim 1, wherein the calibration circuit is formedat least in part on the integrated circuit die.
 3. The memory sub-systemof claim 1, wherein the signal and noise characteristics include a countof memory cells in the group having a predetermined state when a readvoltage is applied on the group of memory cells.
 4. The memorysub-system of claim 1, wherein the signal and noise characteristicsinclude a difference between: a first count of memory cells in the grouphaving a predetermined state when a first read voltage is applied on thegroup of memory cells; and a second count of memory cells in the grouphaving the predetermined state when a second read voltage is applied onthe group of memory cells.
 5. The memory sub-system of claim 1, whereinthe signal and noise characteristics include statistic data of memorycells at varying operating parameters.
 6. The memory sub-system of claim5, wherein the varying operating parameters including different voltagesapplied to read memory cells in the group.
 7. The memory sub-system ofclaim 1, wherein the signal and noise characteristics include a firstoptimized read voltage calculated by the calibration circuit of thememory component; and the attribute includes a second optimized readvoltage calculated by the processing device using at least the signaland noise characteristics.
 8. The memory sub-system of claim 7, whereinthe first optimized read voltage is calculated using a first method; andthe second optimized read voltage is calculated using a second method.9. The memory sub-system of claim 8, wherein the second optimized readvoltage is calculated based on information not available in the memorycomponent during the execution of the command.
 10. The memory sub-systemof claim 9, wherein the information not available in the memorycomponent during the execution of the command includes further signaland noise characteristics generated by the calibration circuit duringexecution of one or more prior commands.
 11. The memory sub-system ofclaim 9, wherein the information not available in the memory componentduring the execution of the command includes data relevant to chargeloss, read disturb, cross-temperature effect, data retention, orprogram/erase, or any combination thereof.
 12. The memory sub-system ofclaim 1, wherein the attribute includes a predictive model generatedbased on the signal and noise characteristics.
 13. A method, comprising:transmitting, by a processing device in a memory sub-system, a commandto a memory component of the memory sub-system to retrieve data from anaddress, the memory component being enclosed in an integrated circuitpackage and configured to, in response to the command and duringexecution of the command, measure signal and noise characteristics of agroup of memory cells formed on an integrated circuit die using acalibration circuit; receiving, in the processing device from the memorycomponent, the signal and noise characteristics measured by thecalibration circuit during the execution of the command; processing, bythe processing device of the memory sub-system, the signal and noisecharacteristics; identifying, by the processing device of the memorysub-system, an attribute about the memory component based the processingof the signal and noise characteristics; and performing, an operationrelated to data stored in the memory component based on the attribute.14. The method of claim 13, wherein the attribute includes adetermination of program failure in the data retrieved by the memorycomponent from the address in response to the command; and the operationincludes skipping decoding the data, or skipping recovering from errorsin the data.
 15. The method of claim 14, wherein the attribute includesa predictive model of an optimized read voltage as a function of one ormore factors.
 16. The method of claim 15, wherein the signal and noisecharacteristics include statistics of memory cells in the group operatedat different levels of an operating parameter.
 17. A non-transitorycomputer storage medium storing instructions which, when executed by acomputing system, cause the computing system to perform a method, themethod comprising: transmitting, by a processing device in a memorysub-system, a command to a memory component of the memory sub-system,the command instructing the memory component to retrieve data from anaddress, wherein the memory component is enclosed in an integratedcircuit package and is configured to, in response to the command andduring execution of the command, measure signal and noisecharacteristics of a group of memory cells formed on an integratedcircuit die using a calibration circuit; receiving, in the processingdevice from the memory component, the signal and noise characteristicsmeasured by the calibration circuit during the execution of the command;processing, by the processing device of the memory sub-system, thesignal and noise characteristics; identifying, by the processing deviceof the memory sub-system, an attribute about the memory component basedthe processing of the signal and noise characteristics; and performing,an operation related to data stored in the memory component based on theattribute.
 18. The non-transitory computer storage medium of claim 17,wherein the attribute includes a predictive model generated based on thesignal and noise characteristics and at least one factor, includingcross-temperature effect, read disturb, program/erase, or dataretention, or any combination thereof.
 19. The non-transitory computerstorage medium of claim 17, wherein the attribute identifies an amountof damage the memory component has as a result of program/erase cycles.20. The non-transitory computer storage medium of claim 17, wherein theattribute identifies margin loss from cross-temperature effect based ontracking shifting of optimized read voltage as a function of operatingtemperature.